74HC10-Q100; 74HCT10-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74HC10D-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 9 | 36 | 3 | low | -40~125 | SO14 |
74HC10PW-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 9 | 36 | 3 | low | -40~125 | TSSOP14 |
74HCT10D-Q100 | 4.5 - 5.5 | TTL | ± 4 | 11 | 36 | 3 | low | -40~125 | SO14 |
74HCT10PW-Q100 | 4.5 - 5.5 | TTL | ± 4 | 11 | 36 | 3 | low | -40~125 | TSSOP14 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74HC10D-Q100 | 74HC10D-Q100J (935300033118) |
Active | 74HC10D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74HC10PW-Q100 | 74HC10PW-Q100J (935300034118) |
Active | HC10 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
74HCT10D-Q100 | 74HCT10D-Q100J (935300059118) |
Active | 74HCT10D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74HCT10PW-Q100 | 74HCT10PW-Q100J (935300061118) |
Active | HCT10 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74HC10D-Q100 | 74HC10D-Q100J | 74HC10D-Q100 | ||
74HC10PW-Q100 | 74HC10PW-Q100J | 74HC10PW-Q100 | ||
74HCT10D-Q100 | 74HCT10D-Q100J | 74HCT10D-Q100 | ||
74HCT10PW-Q100 | 74HCT10PW-Q100J | 74HCT10PW-Q100 |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
74HC_HCT10_Q100 | Triple 3-input NAND gate | Data sheet | 2024-02-20 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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