74LVC1G27-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G27GW-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | TSSOP6 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC1G27GW-Q100 | 74LVC1G27GW-Q100H (935690853125) |
Active | Y7 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC1G27GW-Q100 | 74LVC1G27GW-Q100H | 74LVC1G27GW-Q100 |
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Documentation (5)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC1G27_Q100 | Single 3-input NOR gate | Data sheet | 2023-08-16 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g27 | 74LVC1G27 IBIS model | IBIS model | 2014-10-20 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
Support
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Ordering, pricing & availability
Sample
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