74LVC1G386-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LVC1G386GW-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 4.5 | 150 | 1 | low | -40~125 | TSSOP6 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC1G386GW-Q100 | 74LVC1G386GW-Q100H (935691568125) |
Active | YH |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC1G386GW-Q100 | 74LVC1G386GW-Q100H | 74LVC1G386GW-Q100 |
Documentation (3)
File name | Title | Type | Date |
---|---|---|---|
74LVC1G386_Q100 | 3-input EXCLUSIVE-OR gate | Data sheet | 2023-11-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
Ordering, pricing & availability
Sample
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