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Click here for more informationPMEG030V050EPD
30 V, 5 A low VF MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a CFP15 (SOT1289) power and flat lead Surface-Mounted Device (SMD) plastic package.
Features and benefits
Average forward current: IF(AV) ≤ 5 A
Reverse voltage: VR ≤ 30 V
Extremely low forward voltage
High power capability due to clip-bonding technology and heat sink
Small and thin SMD power plastic package, typical height 0.78 mm
AEC-Q101 qualified
Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Freewheeling application
Reverse polarity protection
Low power consumption application
Parametrics
Type number | Package version | Package name | Size (mm) | VR [max] (V) | IF [max] (A) | Nr of functions | Configuration | IR [max] (µA) | Cd [max] (pF) |
---|---|---|---|---|---|---|---|---|---|
PMEG030V050EPD | SOT1289 | CFP15 | 5.8 x 4.3 x 0.78 | 30.0 | 5.0 | single | single | 30.0 | 495.0 |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
PMEG030V050EPD | 30 V, 5 A low VF MEGA Schottky barrier rectifier | Data sheet | 2017-05-04 |
AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
SOT1289 | 3D model for products with SOT1289 package | Design support | 2019-01-22 |
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
CFP15_SOT1289_mk | plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body | Marcom graphics | 2017-01-28 |
SOT1289 | plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body | Package information | 2022-05-28 |
PMEG030V050EPD_Nexperia_Product_Quality | PMEG030V050EPD Nexperia Product Quality | Quality document | 2019-05-20 |
PMEG030V050EPD_Nexperia_Product_Reliability | PMEG030V050EPD Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PMEG030V050EPD | PMEG030V050EPD SPICE Model | SPICE model | 2016-07-25 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
PMEG030V050EPD | PMEG030V050EPD SPICE Model | SPICE model | 2016-07-25 |
SOT1289 | 3D model for products with SOT1289 package | Design support | 2019-01-22 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.