Featured packages
With about 100 different package options available, it isn’t always easy to pick the right one for your design. Below is a selection of some of our more popular and recommended options.
Leadless
DFN2020M-6 (SOT1220-2)
Low RDS(on) package for consumer applications
MLPAK33 (SOT8002-1)
Surface mount package with thermal enhancement
DFN0606 (SOT8001-1)
Ultra small footprint
WLCSP
Highest efficiency by electrical performance
Leaded (Clip bond technology)
LFPAK56D (SOT1205)
The ultimate dual automotive MOSFET
LFPAK33 (SOT1210)
Shrinking the power footprint
Clip-bonded FlatPower (CFP)
Clip-bonded FlatPower (CFP)
LFPAK88 (SOT1235)
Driving power density to the next level
Leaded (SMD)
VSSOP8 (SOT765-1)
Single, dual or triple gate functions in small footprint packages
SC-70 (SOT323)
Plastic, surface-mounted package
TSSOP6 (SOT363)
Plastic, surface-mounted package
TO-236AB (SOT23)
Plastic, surface-mounted package
Through hole
I2PAK / TO220
High performance through-hole products