
The evaluation board NEVB-NSF-XPAK-A consists of two half-bridges that enables the basic study of the dynamic characteristics of X.PAK devices in single and parallel operation. The board is optimized for low inductance and features a high bandwidth current shunt that can be used to evaluate the switching performance with maximum precision.
Key features & benefits:
The evaluation board circuit consists of two half-bridges that enables the basic study of the dynamic characteristics of X.PAK devices in single and parallel operation.
The SiC MOSFET´s used are 30mOhm X.PAK (NSF030120T2A0) with leading RDSon stability up to 175°C, optimized in all areas to achieve highest efficiency and figure of merit.
Key features of NEVB-NSF-XPAK-A include:
- 4 DUTs in XPAK assembled
- Enhanced PCB design to minimize loop inductance
- Testing Single or Paralleled Devices
Key applications
- E-vehicle charging infrastructure
- Photovoltaic inverters
- Switch mode power supply
- Uninterruptable power supply
- Motor drives
Related boards (1)
Board | Description | Type | Quick links | Shop link | |
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sic-mosfet-x.pak-evaluation-board---nevb-nsf-xpak-a | - | Evaluation board |
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Related boards (1)
Board | Description | Type | Quick links | Shop link | |
---|---|---|---|---|---|
![]() |
sic-mosfet-x.pak-evaluation-board---nevb-nsf-xpak-a | - | Evaluation board |
|
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