Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AVC8T245BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVC8T245BQ-Q100SOT815-1DHVQFN2451.12667 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353005511186126030 s123520 s3Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001271.000000.00249
FillerSilver (Ag)7440-22-40.0953975.000000.18658
PolymerAcrylic resinProprietary0.007636.000000.01493
Resin systemProprietary0.0228918.000000.04478
subTotal0.12719100.000000.24878
DieDoped siliconSilicon (Si)7440-21-30.64392100.000001.25946
subTotal0.64392100.000001.25946
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.9150697.4700036.99646
Iron (Fe)7439-89-60.465742.400000.91096
Phosphorus (P)7723-14-00.005820.030000.01139
Zinc (Zn)7440-66-60.019410.100000.03796
subTotal19.40603100.0000037.95677
Mould CompoundAdditiveNon hazardousProprietary0.880352.984001.72190
FillerSilica -amorphous-7631-86-91.029633.490002.01389
Silica fused60676-86-025.0239484.8200048.94499
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.295611.002000.57820
PigmentCarbon black1333-86-40.048380.164000.09464
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.091883.701002.13565
Epoxy resin systemProprietary0.467911.586000.91519
Phenolic resinProprietary0.664692.253001.30008
subTotal29.50241100.0000057.70454
Pre-PlatingPure metal layerGold (Au)7440-57-50.038813.000000.07591
Nickel (Ni)7440-02-01.1941092.300002.33558
Palladium (Pd)7440-05-30.040113.100000.07844
Silver (Ag)7440-22-40.020701.600000.04049
subTotal1.29372100.000002.53042
WirePure metalCopper (Cu)7440-50-80.1481196.550000.28968
Pure metal layerGold (Au)7440-57-50.000540.350000.00105
Palladium (Pd)7440-05-30.004763.100000.00930
subTotal0.15340100.000000.30003
total51.12667100.00000100.00000
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