Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC4066BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4066BQ-Q100SOT762-1DHVQFN1418.328643 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352984541158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001269
FillerSilver (Ag)7440-22-40.01744575.0000000.095179
PolymerAcrylic resinProprietary0.0013966.0000000.007614
Resin systemProprietary0.00418718.0000000.022843
subTotal0.023260100.0000000.126905
DieDoped siliconSilicon (Si)7440-21-30.352529100.0000001.923378
subTotal0.352529100.0000001.923378
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000036.798739
Iron (Fe)7439-89-60.1660752.4000000.906094
Phosphorus (P)7723-14-00.0020760.0300000.011326
Zinc (Zn)7440-66-60.0069200.1000000.037754
subTotal6.919780100.00000037.753913
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.712713
FillerSilica -amorphous-7631-86-90.3671483.4900002.003140
Silica fused60676-86-08.92307284.82000048.683760
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.575113
PigmentCarbon black1333-86-40.0172530.1640000.094130
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.124247
Epoxy resin systemProprietary0.1668471.5860000.910309
Phenolic resinProprietary0.2370162.2530001.293144
subTotal10.520010100.00000057.396557
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.075521
Nickel (Ni)7440-02-00.42587292.3000002.323534
Palladium (Pd)7440-05-30.0143033.1000000.078039
Silver (Ag)7440-22-40.0073821.6000000.040278
subTotal0.461400100.0000002.517371
WirePure metalCopper (Cu)7440-50-80.04988296.5500000.272152
Pure metal layerGold (Au)7440-57-50.0001810.3500000.000987
Palladium (Pd)7440-05-30.0016023.1000000.008738
subTotal0.051664100.0000000.281877
total18.328643100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.