Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC574BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC574BQSOT764-1DHVQFN2028.00359 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356912751153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00305
FillerSilver (Ag)7440-22-40.0639675.000000.22840
PolymerAcrylic resinProprietary0.005126.000000.01827
Resin systemProprietary0.0153518.000000.05482
subTotal0.08528100.000000.30454
DieDoped siliconSilicon (Si)7440-21-30.31539100.000001.12624
subTotal0.31539100.000001.12624
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.81358
Iron (Fe)7439-89-60.260742.400000.93108
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03880
subTotal10.86402100.0000038.79510
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.74487
FillerSilica -amorphous-7631-86-90.571483.490002.04075
Silica fused60676-86-013.8892084.8200049.59792
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.58591
PigmentCarbon black1333-86-40.026850.164000.09590
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.16413
Epoxy resin systemProprietary0.259711.586000.92740
Phenolic resinProprietary0.368932.253001.31743
subTotal16.37491100.0000058.47431
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509591.000000.89614
Palladium (Pd)7440-05-30.022068.000000.07878
subTotal0.27577100.000000.98477
WirePure metalCopper (Cu)7440-50-80.0851896.550000.30416
Pure metal layerGold (Au)7440-57-50.000310.350000.00110
Palladium (Pd)7440-05-30.002733.100000.00977
subTotal0.08822100.000000.31503
total28.00359100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.