Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT164BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT164BQSOT762-1DHVQFN1417.98854 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527916611512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00129
FillerSilver (Ag)7440-22-40.0174475.000000.09698
PolymerAcrylic resinProprietary0.001406.000000.00776
Resin systemProprietary0.0041918.000000.02327
subTotal0.02326100.000000.12930
DieDoped siliconSilicon (Si)7440-21-30.23655100.000001.31502
subTotal0.23655100.000001.31502
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.81837
Iron (Fe)7439-89-60.167512.400000.93120
Phosphorus (P)7723-14-00.002090.030000.01164
Zinc (Zn)7440-66-60.006980.100000.03880
subTotal6.97956100.0000038.80001
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.74509
FillerSilica -amorphous-7631-86-90.367153.490002.04101
Silica fused60676-86-08.9230684.8200049.60416
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.58599
PigmentCarbon black1333-86-40.017250.164000.09591
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.16441
Epoxy resin systemProprietary0.166851.586000.92752
Phenolic resinProprietary0.237022.253001.31759
subTotal10.52000100.0000058.48168
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00985
Nickel (Ni)7440-02-00.1612391.000000.89629
Palladium (Pd)7440-05-30.014178.000000.07880
subTotal0.17718100.000000.98494
WirePure metalCopper (Cu)7440-50-80.0502096.550000.27909
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001613.100000.00896
subTotal0.05200100.000000.28906
total17.98854100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.