Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT259BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT259BQSOT763-1DHVQFN1621.74349 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528845611513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00458
FillerSilver (Ag)7440-22-40.0747675.000000.34383
PolymerAcrylic resinProprietary0.005986.000000.02751
Resin systemProprietary0.0179418.000000.08252
subTotal0.09968100.000000.45844
DieDoped siliconSilicon (Si)7440-21-30.68820100.000003.16509
subTotal0.68820100.000003.16509
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.99303
Iron (Fe)7439-89-60.198062.400000.91088
Phosphorus (P)7723-14-00.002480.030000.01139
Zinc (Zn)7440-66-60.008250.100000.03795
subTotal8.25236100.0000037.95325
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.70701
FillerSilica -amorphous-7631-86-90.434103.490001.99647
Silica fused60676-86-010.5503084.8200048.52166
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57320
PigmentCarbon black1333-86-40.020400.164000.09382
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.11717
Epoxy resin systemProprietary0.197271.586000.90728
Phenolic resinProprietary0.280242.253001.28884
subTotal12.43846100.0000057.20545
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00963
Nickel (Ni)7440-02-00.1906391.000000.87671
Palladium (Pd)7440-05-30.016768.000000.07707
subTotal0.20948100.000000.96341
WirePure metalCopper (Cu)7440-50-80.0534096.550000.24558
Pure metal layerGold (Au)7440-57-50.000190.350000.00089
Palladium (Pd)7440-05-30.001713.100000.00788
subTotal0.05531100.000000.25435
total21.74349100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.