Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT4060BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT4060BQ-Q100SOT763-1DHVQFN1621.808925 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352988941155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.137558
ImpurityNon hazardousProprietary0.0000200.0395000.000091
PolymerResin systemProprietary0.01997639.9514100.091594
subTotal0.050000100.0000000.229243
DieDoped siliconSilicon (Si)7440-21-30.807441100.0000003.702340
subTotal0.807441100.0000003.702340
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.882035
Iron (Fe)7439-89-60.1980572.4000000.908145
Phosphorus (P)7723-14-00.0024760.0300000.011352
Zinc (Zn)7440-66-60.0082520.1000000.037839
subTotal8.252360100.00000037.839371
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.701889
FillerSilica -amorphous-7631-86-90.4341023.4900001.990480
Silica fused60676-86-010.55030284.82000048.376074
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.571479
PigmentCarbon black1333-86-40.0203990.1640000.093535
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.110821
Epoxy resin systemProprietary0.1972741.5860000.904556
Phenolic resinProprietary0.2802392.2530001.284972
subTotal12.438460100.00000057.033806
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009605
Nickel (Ni)7440-02-00.19062791.0000000.874077
Palladium (Pd)7440-05-30.0167588.0000000.076842
subTotal0.209480100.0000000.960524
WirePure metalCopper (Cu)7440-50-80.04941896.5500000.226596
Pure metal layerGold (Au)7440-57-50.0001790.3500000.000821
Palladium (Pd)7440-05-30.0015873.1000000.007275
subTotal0.051184100.0000000.234693
total21.808925100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.