Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT4066BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT4066BQ-Q100SOT762-1DHVQFN1418.32699 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352984571157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00127
FillerSilver (Ag)7440-22-40.0174475.000000.09519
PolymerAcrylic resinProprietary0.001406.000000.00761
Resin systemProprietary0.0041918.000000.02284
subTotal0.02326100.000000.12691
DieDoped siliconSilicon (Si)7440-21-30.35253100.000001.92355
subTotal0.35253100.000001.92355
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.80206
Iron (Fe)7439-89-60.166072.400000.90618
Phosphorus (P)7723-14-00.002080.030000.01133
Zinc (Zn)7440-66-60.006920.100000.03776
subTotal6.91978100.0000037.75733
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.71287
FillerSilica -amorphous-7631-86-90.367153.490002.00332
Silica fused60676-86-08.9230784.8200048.68815
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.57517
PigmentCarbon black1333-86-40.017250.164000.09414
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.12444
Epoxy resin systemProprietary0.166851.586000.91039
Phenolic resinProprietary0.237022.253001.29326
subTotal10.52001100.0000057.40174
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07553
Nickel (Ni)7440-02-00.4258792.300002.32374
Palladium (Pd)7440-05-30.014303.100000.07805
Silver (Ag)7440-22-40.007381.600000.04028
subTotal0.46140100.000002.51760
WirePure metalCopper (Cu)7440-50-80.0482996.550000.26348
Pure metal layerGold (Au)7440-57-50.000180.350000.00096
Palladium (Pd)7440-05-30.001553.100000.00846
subTotal0.05001100.000000.27290
total18.32699100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.