Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2T45GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2T45GFSOT1089XSON81.813558 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352915131159126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.120578100.0000006.648671
subTotal0.120578100.0000006.648671
ComponentAdditiveNon hazardousProprietary0.0010005.0000000.055140
FillerAluminium Trioxide (Al2O3)1344-28-10.00800040.0000000.441122
PolymerBisphenol A-epichlorohydrin resin25068-38-60.00200010.0000000.110280
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.00300015.0000000.165421
Resin systemProprietary0.00600030.0000000.330841
subTotal0.020000100.0000001.102805
Lead FrameCopper alloyCopper (Cu)7440-50-80.63723795.11000035.137393
Magnesium (Mg)7439-95-40.0013400.2000000.073888
Nickel (Ni)7440-02-00.0212393.1700001.171123
Silicon (Si)7440-21-30.0046230.6900000.254913
Pure metal layerGold (Au)7440-57-50.0001340.0200000.007389
Nickel (Ni)7440-02-00.0049580.7400000.273385
Palladium (Pd)7440-05-30.0004690.0700000.025861
subTotal0.670000100.00000036.943952
Mould CompoundFillerSilica -amorphous-7631-86-90.21620023.00000011.921317
Silica fused60676-86-00.56400060.00000031.099088
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0282003.0000001.554954
Ion trapping agentBismuth (Bi)7440-69-90.0047000.5000000.259159
PigmentCarbon black1333-86-40.0047000.5000000.259159
PolymerEpoxy resin systemProprietary0.0658007.0000003.628227
Phenolic resinProprietary0.0564006.0000003.109909
subTotal0.940000100.00000051.831813
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000010.0030000.000050
Bismuth (Bi)7440-69-90.0000000.0010000.000017
Copper (Cu)7440-50-80.0000000.0010000.000017
Lead (Pb)7439-92-10.0000020.0050000.000083
Tin solderTin (Sn)7440-31-50.02999799.9900001.654041
subTotal0.030000100.0000001.654207
WireGold alloyGold (Au)7440-57-50.03265099.0000001.800339
Palladium (Pd)7440-05-30.0003301.0000000.018185
subTotal0.032980100.0000001.818525
total1.813558100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.