Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS16LD-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS16LD-QSOD882DDFN1006-20.659050 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346677473151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.345953
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.047660
Phenolic resinProprietary0.00040613.5300000.061589
subTotal0.003000100.0000000.455201
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000003.034671
subTotal0.020000100.0000003.034671
Lead FrameCopper alloyChromium (Cr)7440-47-30.0008030.2575000.121903
Copper (Cu)7440-50-80.29576094.79500044.876777
Tin (Sn)7440-31-50.0007450.2388000.113050
Zinc (Zn)7440-66-60.0005950.1908000.090326
Pure metal layerGold (Au)7440-57-50.0001720.0550000.026037
Nickel (Ni)7440-02-00.0133914.2920002.031870
Palladium (Pd)7440-05-30.0005330.1709000.080906
subTotal0.312000100.00000047.340869
Mould CompoundFillerSilica -amorphous-7631-86-90.06877023.00000010.434717
Silica fused60676-86-00.17940060.00000027.221000
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089703.0000001.361050
Ion trapping agentBismuth (Bi)7440-69-90.0014950.5000000.226842
PigmentCarbon black1333-86-40.0014950.5000000.226842
PolymerEpoxy resin systemProprietary0.0209307.0000003.175783
Phenolic resinProprietary0.0179406.0000002.722100
subTotal0.299000100.00000045.368333
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000150
Non hazardousProprietary0.0000120.0555000.001853
Tin solderTin (Sn)7440-31-50.02198799.9400003.336135
subTotal0.022000100.0000003.338138
WireImpurityNon hazardousProprietary0.0000000.0100000.000046
Pure metalGold (Au)7440-57-50.00305099.9900000.462741
subTotal0.003050100.0000000.462787
total0.659050100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.