Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS21LS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS21LS-QSOD882BDDFN1006-20.898480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662684315612601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.607159
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.221407
Phenolic resinProprietary0.00257113.5300000.286117
subTotal0.019000100.0000002.114683
DieDoped siliconSilicon (Si)7440-21-30.037000100.0000004.118066
subTotal0.037000100.0000004.118066
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000042.028760
Magnesium (Mg)7439-95-40.0005920.1500000.065945
Nickel (Ni)7440-02-00.0117712.9800001.310102
Silicon (Si)7440-21-30.0025680.6500000.285760
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004396
Nickel (Ni)7440-02-00.0022520.5700000.250590
Palladium (Pd)7440-05-30.0001580.0400000.017585
subTotal0.395000100.00000043.963138
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.756945
Silica fused60676-86-00.33878980.09200037.706923
PigmentCarbon black1333-86-40.0039250.9280000.436898
PolymerEpoxy resin systemProprietary0.0357448.4500003.978219
Phenolic resinProprietary0.0107862.5500001.200528
subTotal0.423000100.00000047.079512
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000100
Non hazardousProprietary0.0000110.0555000.001235
Tin solderTin (Sn)7440-31-50.01998899.9400002.224646
subTotal0.020000100.0000002.225982
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00448099.9900000.498570
subTotal0.004480100.0000000.498620
total0.898480100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.