Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAV170QA-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAV170QA-QSOT1215DFN1010D-31.145880 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346677031471126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02640080.0000002.303906
PolymerAcrylic resinProprietary0.00660020.0000000.575977
subTotal0.033000100.0000002.879883
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000003.490767
subTotal0.040000100.0000003.490767
Lead FrameCopper alloyCopper (Cu)7440-50-80.47875491.54000041.780483
Magnesium (Mg)7439-95-40.0008890.1700000.077591
Nickel (Ni)7440-02-00.0149062.8500001.300791
Silicon (Si)7440-21-30.0032430.6200000.282979
Pure metal layerGold (Au)7440-57-50.0003660.0700000.031949
Nickel (Ni)7440-02-00.0227504.3500001.985417
Palladium (Pd)7440-05-30.0020920.4000000.182567
subTotal0.523000100.00000045.641777
Mould CompoundFillerSilica -amorphous-7631-86-90.11776023.00000010.276818
Silica fused60676-86-00.30720060.00000026.809090
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153603.0000001.340454
Ion trapping agentBismuth (Bi)7440-69-90.0025600.5000000.223409
PigmentCarbon black1333-86-40.0025600.5000000.223409
PolymerEpoxy resin systemProprietary0.0358407.0000003.127727
Phenolic resinProprietary0.0307206.0000002.680909
subTotal0.512000100.00000044.681817
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000114
Non hazardousProprietary0.0000160.0555000.001405
Tin solderTin (Sn)7440-31-50.02898399.9400002.529288
subTotal0.029000100.0000002.530806
WireImpurityNon hazardousProprietary0.0000010.0100000.000077
Pure metalGold (Au)7440-57-50.00887999.9900000.774873
subTotal0.008880100.0000000.774950
total1.145880100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.