Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAW101-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAW101-QSOT143BSOT48.914543 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346676752151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000001.121762
subTotal0.100000100.0000001.121762
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0026960.0800000.030243
Carbon (C)7440-44-00.0013480.0400000.015121
Chromium (Cr)7440-47-30.0070770.2100000.079387
Cobalt (Co)7440-48-40.0141540.4200000.158774
Iron (Fe)7439-89-61.59333647.28000017.873446
Manganese (Mn)7439-96-50.0286450.8500000.321329
Nickel (Ni)7440-02-01.20039435.62000013.465570
Phosphorus (P)7723-14-00.0006740.0200000.007561
Silicon (Si)7440-21-30.0087620.2600000.098289
Sulphur (S)7704-34-90.0006740.0200000.007561
Pure metal layerCopper (Cu)7440-50-80.44079613.0800004.944684
Silver (Ag)7440-22-40.0714442.1200000.801432
subTotal3.370000100.00000037.803396
Mould CompoundFillerSilica fused60676-86-03.52870071.00000039.583633
PigmentCarbon black1333-86-40.0149100.3000000.167255
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.97909019.70000010.983064
Phenolic resinProprietary0.4473009.0000005.017644
subTotal4.970000100.00000055.751596
Post-PlatingImpurityLead (Pb)7439-92-10.0000210.0045000.000237
Non hazardousProprietary0.0002610.0555000.002926
Tin solderTin (Sn)7440-31-50.46971899.9400005.269120
subTotal0.470000100.0000005.272284
WireImpurityNon hazardousProprietary0.0000000.0100000.000005
Pure metalGold (Au)7440-57-50.00454399.9900000.050957
subTotal0.004543100.0000000.050962
total8.914543100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.