Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC817-25QC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC817-25QC-QSOT8009DFN1412D-32.504773 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662727147112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.212394
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.029260
Phenolic resinProprietary0.00094713.5300000.037812
subTotal0.007000100.0000000.279466
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000002.395427
subTotal0.060000100.0000002.395427
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920043.496998
Magnesium (Mg)7439-95-40.0016980.1454000.067801
Nickel (Ni)7440-02-00.0339762.9089001.356448
Silicon (Si)7440-21-30.0073620.6303000.293915
Pure metal layerGold (Au)7440-57-50.0004360.0373000.017393
Nickel (Ni)7440-02-00.0335472.8722001.339335
Palladium (Pd)7440-05-30.0014800.1267000.059081
subTotal1.168000100.00000046.630972
Mould CompoundAdditiveNon hazardousProprietary0.0048460.4100000.193479
FillerSilica -amorphous-7631-86-90.0034280.2900000.136851
Silica fused60676-86-01.01829386.15000040.654103
HardenerPhenolic resinProprietary0.0507084.2900002.024447
PigmentCarbon black1333-86-40.0022460.1900000.089661
PolymerEpoxy resin systemProprietary0.1024798.6700004.091365
subTotal1.182000100.00000047.189905
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000149
Non hazardousProprietary0.0000460.0555000.001839
Tin solderTin (Sn)7440-31-50.08295099.9400003.311685
subTotal0.083000100.0000003.313674
WireImpurityNon hazardousProprietary0.0000000.0100000.000019
Pure metalCopper (Cu)7440-50-80.00477399.9900000.190537
subTotal0.004773100.0000000.190556
total2.504773100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.