Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC868

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC868SOT89MPT340.519530 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93367877011514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08470077.0000000.209035
PolymerResin systemProprietary0.02530023.0000000.062439
subTotal0.110000100.0000000.271474
DieDoped siliconSilicon (Si)7440-21-30.330000100.0000000.814422
subTotal0.330000100.0000000.814422
Lead FrameCopper alloyCopper (Cu)7440-50-817.12911299.82000042.273718
Iron (Fe)7439-89-60.0171600.1000000.042350
Phosphorus (P)7723-14-00.0051480.0300000.012705
Pure metal layerSilver (Ag)7440-22-40.0085800.0500000.021175
subTotal17.160000100.00000042.349948
Mould CompoundAdditiveNon hazardousProprietary0.6614902.9000001.632521
Triphenylphosphine603-35-00.0114050.0500000.028147
FillerSilica -amorphous-7631-86-916.42320072.00000040.531566
PigmentCarbon black1333-86-40.0114050.0500000.028147
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.42150015.0000008.444076
Phenol Formaldehyde resin (generic)9003-35-42.28100010.0000005.629384
subTotal22.810000100.00000056.293842
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000008
Non hazardousProprietary0.0000390.0555000.000096
Tin solderTin (Sn)7440-31-50.06995899.9400000.172653
subTotal0.070000100.0000000.172756
WirePure metalGold (Au)7440-57-50.039525100.0000000.097546
subTotal0.039525100.0000000.097546
total40.519530100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.