Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSR33PAS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934667653115BSR33PAS-QXBSR33PAS-QSOT1061 (HUSON3)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 17428 ppm; substance 1333-86-4: 1070 ppm; substance 7439-92-1: 1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 17428 ppm; substance 1333-86-4: 1070 ppm; substance 7439-92-1: 1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 11638 ppm; substance 7440-05-3: 371 ppm; substance 7440-57-5: 222 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.163769
AdhesivePolymerAcrylic resin0.02200020.0000000.290942
Adhesive Total0.110000100.0000001.454711
DieDoped siliconSilicon (Si)7440-21-30.210000100.0000002.777175
Die Total0.210000100.0000002.777175
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.797658
Lead FrameCopper alloyNickel (Ni)7440-02-00.1037483.7000001.372030
Lead FrameCopper alloySilicon (Si)7440-21-30.0224320.8000000.296655
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0140200.5000000.185410
Lead FramePure metal layerNickel (Ni)7440-02-00.0280401.0000000.370819
Lead FramePure metal layerPalladium (Pd)7440-05-30.0028040.1000000.037082
Lead FramePure metal layerGold (Au)7440-57-50.0016820.0600000.022249
Lead Frame Total2.804000100.00000037.081903
Mould CompoundFillerSilica fused60676-86-03.66999086.15000048.534313
Mould CompoundPolymerEpoxy resin system0.3693428.6700004.884417
Mould CompoundHardenerPhenolic resin0.1827544.2900002.416857
Mould CompoundAdditiveNon hazardous0.0174660.4100000.230981
Mould CompoundFillerSilica -amorphous-7631-86-90.0123540.2900000.163377
Mould CompoundPigmentCarbon black1333-86-40.0080940.1900000.107040
Mould Compound Total4.260000100.00000056.336985
Post-PlatingTin solderTin (Sn)7440-31-50.16989899.9400002.246841
Post-PlatingImpurityNon hazardous0.0000940.0555000.001248
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000101
Post-Plating Total0.170000100.0000002.248190
WirePure metalCopper (Cu)7440-50-80.00763999.9900000.101026
WireImpurityNon hazardous0.0000010.0100000.000010
Wire Total0.007640100.0000000.101036
BSR33PAS-Q Total7.561640100.000000100.000000
Notes
Report created on 2024-10-26 17:44:47 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:44:47 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:44:47 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.