Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSS138AKQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSS138AKQB-QSOT8015DFN1110D-31.599914 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346673741473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00532076.0000000.332518
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00073310.4700000.045809
Phenolic resinProprietary0.00094713.5300000.059197
subTotal0.007000100.0000000.437524
DieDoped siliconSilicon (Si)7440-21-30.027400100.0000001.712592
subTotal0.027400100.0000001.712592
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600044.927835
Magnesium (Mg)7439-95-40.0011200.1490000.070034
Nickel (Ni)7440-02-00.0224162.9809001.401098
Silicon (Si)7440-21-30.0048570.6459000.303589
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003619
Nickel (Ni)7440-02-00.0044670.5940000.279195
Palladium (Pd)7440-05-30.0002740.0365000.017156
subTotal0.752000100.00000047.002526
Mould CompoundFillerSilica -amorphous-7631-86-90.0600107.9800003.750802
Silica fused60676-86-00.60229280.09200037.645263
PigmentCarbon black1333-86-40.0069790.9280000.436183
PolymerEpoxy resin systemProprietary0.0635448.4500003.971713
Phenolic resinProprietary0.0191762.5500001.198564
subTotal0.752000100.00000047.002526
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000160
Non hazardousProprietary0.0000320.0555000.001977
Tin solderTin (Sn)7440-31-50.05696699.9400003.560554
subTotal0.057000100.0000003.562691
WireImpurityNon hazardousProprietary0.0000000.0100000.000028
Pure metalCopper (Cu)7440-50-80.00451499.9900000.282112
subTotal0.004514100.0000000.282140
total1.599914100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.