Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSS138AKRA-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSS138AKRA-QSOT1268-1DFN1412-62.350900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346673771473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10640076.0000004.525926
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.01465810.4700000.623506
Phenolic resinProprietary0.01894213.5300000.805734
subTotal0.140000100.0000005.955166
DieDoped siliconSilicon (Si)7440-21-30.054800100.0000002.331022
subTotal0.054800100.0000002.331022
Lead FrameCopper alloyCopper (Cu)7440-50-80.91850995.67800039.070518
Magnesium (Mg)7439-95-40.0014320.1492000.060926
Nickel (Ni)7440-02-00.0286442.9837001.218407
Silicon (Si)7440-21-30.0062060.6465000.264001
Pure metal layerGold (Au)7440-57-50.0001090.0114000.004655
Nickel (Ni)7440-02-00.0047570.4955000.202340
Palladium (Pd)7440-05-30.0003430.0357000.014578
subTotal0.960000100.00000040.835425
Mould CompoundFillerSilica -amorphous-7631-86-90.25990023.00000011.055341
Silica fused60676-86-00.67800060.00000028.840019
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0339003.0000001.442001
Ion trapping agentBismuth (Bi)7440-69-90.0056500.5000000.240333
PigmentCarbon black1333-86-40.0056500.5000000.240333
PolymerEpoxy resin systemProprietary0.0791007.0000003.364669
Phenolic resinProprietary0.0678006.0000002.884002
subTotal1.130000100.00000048.066698
Post-PlatingImpurityLead (Pb)7439-92-10.0000020.0045000.000096
Non hazardousProprietary0.0000280.0555000.001180
Tin solderTin (Sn)7440-31-50.04997099.9400002.125569
subTotal0.050000100.0000002.126845
WireImpurityNon hazardousProprietary0.0000020.0100000.000068
Pure metalGold (Au)7440-57-50.01609899.9900000.684776
subTotal0.016100100.0000000.684844
total2.350900100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.