Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK4D122-20P

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK4D122-20PSOT1220DFN2020MD-67.024363 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346612641157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.797225
PolymerAcrylic resinProprietary0.01400020.0000000.199306
subTotal0.070000100.0000000.996532
DieDoped siliconSilicon (Si)7440-21-30.150000100.0000002.135425
subTotal0.150000100.0000002.135425
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560038.507589
Magnesium (Mg)7439-95-40.0042170.1459000.060027
Nickel (Ni)7440-02-00.0843532.9188001.200868
Silicon (Si)7440-21-30.0182760.6324000.260185
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013700
Nickel (Ni)7440-02-00.0740132.5610001.053660
Palladium (Pd)7440-05-30.0032660.1130000.046491
subTotal2.890000100.00000041.142521
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000012.213207
Silica fused60676-86-02.23800060.00000031.860540
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.593027
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.265505
PigmentCarbon black1333-86-40.0186500.5000000.265505
PolymerEpoxy resin systemProprietary0.2611007.0000003.717063
Phenolic resinProprietary0.2238006.0000003.186054
subTotal3.730000100.00000053.100900
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0000940.0555000.001343
Tin solderTin (Sn)7440-31-50.16989899.9400002.418696
subTotal0.170000100.0000002.420148
WireImpurityNon hazardousProprietary0.0000010.0100000.000020
Pure metalCopper (Cu)7440-50-80.01436299.9900000.204456
subTotal0.014363100.0000000.204477
total7.024363100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.