Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK6M61-60P

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK6M61-60PSOT1210mLFPAK41.772000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346679071153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.912000100.0000002.183281
subTotal0.912000100.0000002.183281
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000013.618213
Iron (Fe)7439-89-60.0085500.1500000.020468
Phosphorus (P)7723-14-00.0028500.0500000.006823
subTotal5.700000100.00000013.645504
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000033.209327
Iron (Fe)7439-89-60.0208500.1500000.049914
Phosphorus (P)7723-14-00.0069500.0500000.016638
subTotal13.900000100.00000033.275879
Mould CompoundFillerSilica fused60676-86-05.28860062.00000012.660634
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.165158
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.040841
PigmentCarbon black1333-86-40.0426500.5000000.102102
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.408408
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.246242
Phenolic resinProprietary0.7506408.8000001.796993
subTotal8.530000100.00000020.420377
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000922
Tin alloyTin (Sn)7440-31-53.84961599.9900009.215779
subTotal3.850000100.0000009.216700
Solder PasteLead alloyLead (Pb)7439-92-14.10700092.5000009.831945
Silver (Ag)7440-22-40.1110002.5000000.265728
Tin (Sn)7440-31-50.2220005.0000000.531456
subTotal4.440000100.00000010.629130
Solder PasteImpurityAntimony (Sb)7440-36-00.0013320.0300000.003189
Lead alloyLead (Pb)7439-92-14.10566892.4700009.828756
Silver (Ag)7440-22-40.1110002.5000000.265728
Tin (Sn)7440-31-50.2220005.0000000.531456
subTotal4.440000100.00000010.629130
total41.772000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.