Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK6Y24-40P

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK6Y24-40PSOT669LFPAK77.062000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346618941155126030 s123520 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.912000100.0000001.183463
subTotal0.912000100.0000001.183463
ClipCopper alloyCopper (Cu)7440-50-84.99000099.8000006.475306
Iron (Fe)7439-89-60.0075000.1500000.009732
Phosphorus (P)7723-14-00.0025000.0500000.003244
subTotal5.000000100.0000006.488282
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000049.100686
Iron (Fe)7439-89-60.0568650.1500000.073791
Phosphorus (P)7723-14-00.0151640.0400000.019678
subTotal37.910000100.00000049.194155
Mould CompoundAdditiveNon hazardousProprietary1.2928205.8000001.677636
FillerSilica -amorphous-7631-86-91.4042706.3000001.822260
Silica fused60676-86-016.04880072.00000020.825829
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.4458002.0000000.578495
PigmentCarbon black1333-86-40.0668700.3000000.086774
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.4903802.2000000.636345
Epoxy resin systemProprietary1.3374006.0000001.735486
Phenol Formaldehyde resin (generic)9003-35-41.2036605.4000001.561937
subTotal22.290000100.00000028.924762
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000500
Tin alloyTin (Sn)7440-31-53.84961599.9900004.995478
subTotal3.850000100.0000004.995977
Solder PasteLead alloyLead (Pb)7439-92-16.56750092.5000008.522359
Silver (Ag)7440-22-40.1775002.5000000.230334
Tin (Sn)7440-31-50.3550005.0000000.460668
subTotal7.100000100.0000009.213361
total77.062000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.