Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7M5R0-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7M5R0-40HSOT1210mLFPAK50.690000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346607831153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.440000100.0000000.868021
subTotal0.440000100.0000000.868021
ClipCopper alloyCopper (Cu)7440-50-818.66260099.80000036.817124
Iron (Fe)7439-89-60.0280500.1500000.055336
Phosphorus (P)7723-14-00.0093500.0500000.018445
subTotal18.700000100.00000036.890906
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000027.366739
Iron (Fe)7439-89-60.0208500.1500000.041132
Phosphorus (P)7723-14-00.0069500.0500000.013711
subTotal13.900000100.00000027.421582
Mould CompoundFillerSilica fused60676-86-05.28860062.00000010.433222
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000002.608305
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.033656
PigmentCarbon black1333-86-40.0426500.5000000.084139
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.336556
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000001.851055
Phenolic resinProprietary0.7506408.8000001.480844
subTotal8.530000100.00000016.827777
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000760
Tin alloyTin (Sn)7440-31-53.84961599.9900007.594427
subTotal3.850000100.0000007.595186
Solder PasteLead alloyLead (Pb)7439-92-11.47075092.5000002.901460
Silver (Ag)7440-22-40.0397502.5000000.078418
Tin (Sn)7440-31-50.0795005.0000000.156836
subTotal1.590000100.0000003.136713
Solder PasteImpurityAntimony (Sb)7440-36-00.0011040.0300000.002178
Lead alloyLead (Pb)7439-92-13.40289692.4700006.713151
Silver (Ag)7440-22-40.0920002.5000000.181495
Tin (Sn)7440-31-50.1840005.0000000.362991
subTotal3.680000100.0000007.259815
total50.690000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.