Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7Y72-80E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7Y72-80ESOT669LFPAK88.390000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340674251154126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.710000100.0000000.803258
subTotal0.710000100.0000000.803258
ClipCopper alloyCopper (Cu)7440-50-819.97400099.87000022.597579
Iron (Fe)7439-89-60.0200000.1000000.022627
Phosphorus (P)7723-14-00.0060000.0300000.006788
subTotal20.000000100.00000022.626994
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000042.807977
Iron (Fe)7439-89-60.0568650.1500000.064334
Phosphorus (P)7723-14-00.0151640.0400000.017156
subTotal37.910000100.00000042.889467
Mould CompoundAdditiveNon hazardousProprietary1.3067405.8000001.478380
FillerSilica -amorphous-7631-86-91.4193906.3000001.605826
Silica fused60676-86-016.22160072.00000018.352302
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.4506002.0000000.509786
PigmentCarbon black1333-86-40.0675900.3000000.076468
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.4956602.2000000.560765
Epoxy resin systemProprietary1.3518006.0000001.529359
Phenol Formaldehyde resin (generic)9003-35-41.2166205.4000001.376423
subTotal22.530000100.00000025.489309
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000436
Tin alloyTin (Sn)7440-31-53.84961599.9900004.355261
subTotal3.850000100.0000004.355696
Solder PasteLead alloyLead (Pb)7439-92-13.13575092.5000003.547630
Silver (Ag)7440-22-40.0847502.5000000.095882
Tin (Sn)7440-31-50.1695005.0000000.191764
subTotal3.390000100.0000003.835275
total88.390000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.