Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M52-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M52-40ESOT1210mLFPAK35.300000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340700911151126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.480000100.0000001.359773
subTotal0.480000100.0000001.359773
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000016.115014
Iron (Fe)7439-89-60.0085500.1500000.024221
Phosphorus (P)7723-14-00.0028500.0500000.008074
subTotal5.700000100.00000016.147309
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000039.298017
Iron (Fe)7439-89-60.0208500.1500000.059065
Phosphorus (P)7723-14-00.0069500.0500000.019688
subTotal13.900000100.00000039.376771
Mould CompoundFillerSilica fused60676-86-05.28860062.00000014.981870
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.745467
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.048329
PigmentCarbon black1333-86-40.0426500.5000000.120822
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.483286
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.658074
Phenolic resinProprietary0.7506408.8000002.126459
subTotal8.530000100.00000024.164306
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001091
Tin alloyTin (Sn)7440-31-53.84961599.99000010.905425
subTotal3.850000100.00000010.906516
Solder PasteLead alloyLead (Pb)7439-92-12.58075092.5000007.310907
Silver (Ag)7440-22-40.0697502.5000000.197592
Tin (Sn)7440-31-50.1395005.0000000.395184
subTotal2.790000100.0000007.903683
total35.300000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.