Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZB784-C4V7

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZB784-C4V7SOT323SC-705.495513 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340563031151212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000001.455733
subTotal0.080000100.0000001.455733
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016200.0900000.029479
Carbon (C)7440-44-00.0007200.0400000.013102
Chromium (Cr)7440-47-30.0037800.2100000.068783
Cobalt (Co)7440-48-40.0075600.4200000.137567
Iron (Fe)7439-89-60.84906047.17000015.450059
Manganese (Mn)7439-96-50.0153000.8500000.278409
Nickel (Ni)7440-02-00.63972035.54000011.640769
Phosphorus (P)7723-14-00.0003600.0200000.006551
Silicon (Si)7440-21-30.0045000.2500000.081885
Sulphur (S)7704-34-90.0003600.0200000.006551
Pure metal layerCopper (Cu)7440-50-80.23490013.0500004.274396
Silver (Ag)7440-22-40.0421202.3400000.766443
subTotal1.800000100.00000032.753994
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.463360
PigmentCarbon black1333-86-40.0102000.3000000.185606
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.827015
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.392675
subTotal3.400000100.00000061.868655
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000115
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000191
Tin solderTin (Sn)7440-31-50.20997999.9900003.820917
subTotal0.210000100.0000003.821299
WirePure metalCopper (Cu)7440-50-80.005513100.0000000.100318
subTotal0.005513100.0000000.100318
total5.495513100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.