Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B39-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B39-QSOD882BDDFN1006-20.900588 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666563152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.603397
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.220889
Phenolic resinProprietary0.00257113.5300000.285447
subTotal0.019000100.0000002.109733
DieDoped siliconSilicon (Si)7440-21-30.039000100.0000004.330504
subTotal0.039000100.0000004.330504
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.930383
Magnesium (Mg)7439-95-40.0005920.1500000.065790
Nickel (Ni)7440-02-00.0117712.9800001.307035
Silicon (Si)7440-21-30.0025680.6500000.285092
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004386
Nickel (Ni)7440-02-00.0022520.5700000.250003
Palladium (Pd)7440-05-30.0001580.0400000.017544
subTotal0.395000100.00000043.860234
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.748151
Silica fused60676-86-00.33878980.09200037.618662
PigmentCarbon black1333-86-40.0039250.9280000.435875
PolymerEpoxy resin systemProprietary0.0357448.4500003.968907
Phenolic resinProprietary0.0107862.5500001.197717
subTotal0.423000100.00000046.969313
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000100
Non hazardousProprietary0.0000110.0555000.001233
Tin solderTin (Sn)7440-31-50.01998899.9400002.219439
subTotal0.020000100.0000002.220771
WireImpurityNon hazardousProprietary0.0000000.0100000.000051
Pure metalGold (Au)7440-57-50.00458899.9900000.509450
subTotal0.004588100.0000000.509500
total0.900588100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.