Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B51-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B51-QSOD882BDDFN1006-20.90059 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666593152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.60339
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22089
Phenolic resinProprietary0.0025713.530000.28545
subTotal0.01900100.000002.10973
DieDoped siliconSilicon (Si)7440-21-30.03900100.000004.33049
subTotal0.03900100.000004.33049
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.93029
Magnesium (Mg)7439-95-40.000590.150000.06579
Nickel (Ni)7440-02-00.011772.980001.30703
Silicon (Si)7440-21-30.002570.650000.28509
Pure metal layerGold (Au)7440-57-50.000040.010000.00439
Nickel (Ni)7440-02-00.002250.570000.25000
Palladium (Pd)7440-05-30.000160.040000.01754
subTotal0.39500100.0000043.86013
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.74814
Silica fused60676-86-00.3387980.0920037.61858
PigmentCarbon black1333-86-40.003930.928000.43587
PolymerEpoxy resin systemProprietary0.035748.450003.96890
Phenolic resinProprietary0.010792.550001.19771
subTotal0.42300100.0000046.96920
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.21943
subTotal0.02000100.000002.22076
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045999.990000.50945
subTotal0.00459100.000000.50950
total0.90059100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.