Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BZX8850S-B9V1-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8850S-B9V1-QSOD882BDDFN1006-20.91159 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346666413152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.58405
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.21822
Phenolic resinProprietary0.0025713.530000.28200
subTotal0.01900100.000002.08427
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.48492
subTotal0.05000100.000005.48492
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.42432
Magnesium (Mg)7439-95-40.000590.150000.06500
Nickel (Ni)7440-02-00.011772.980001.29126
Silicon (Si)7440-21-30.002570.650000.28165
Pure metal layerGold (Au)7440-57-50.000040.010000.00433
Nickel (Ni)7440-02-00.002250.570000.24699
Palladium (Pd)7440-05-30.000160.040000.01733
subTotal0.39500100.0000043.33088
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.70291
Silica fused60676-86-00.3387980.0920037.16464
PigmentCarbon black1333-86-40.003930.928000.43061
PolymerEpoxy resin systemProprietary0.035748.450003.92101
Phenolic resinProprietary0.010792.550001.18326
subTotal0.42300100.0000046.40243
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00122
Tin solderTin (Sn)7440-31-50.0199999.940002.19265
subTotal0.02000100.000002.19397
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045999.990000.50330
subTotal0.00459100.000000.50335
total0.91159100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.