Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBZ33VBU-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ33VBU-QSOT323SC-705.523662 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666841115212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.094000100.0000001.701770
subTotal0.094000100.0000001.701770
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016600.0900000.030045
Carbon (C)7440-44-00.0007380.0400000.013353
Chromium (Cr)7440-47-30.0016600.0900000.030045
Cobalt (Co)7440-48-40.0079290.4300000.143550
Iron (Fe)7439-89-60.81965844.45000014.839033
Manganese (Mn)7439-96-50.0127240.6900000.230347
Nickel (Ni)7440-02-00.63415234.39000011.480637
Phosphorus (P)7723-14-00.0003690.0200000.006677
Silicon (Si)7440-21-30.0047940.2600000.086797
Sulphur (S)7704-34-90.0003690.0200000.006677
Pure metal layerCopper (Cu)7440-50-80.32030317.3700005.798740
Silver (Ag)7440-22-40.0396462.1500000.717748
subTotal1.844000100.00000033.383650
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.769297
Triphenylphosphine603-35-00.0016850.0500000.030505
FillerSilica -amorphous-7631-86-92.42640072.00000043.927380
PigmentCarbon black1333-86-40.0016850.0500000.030505
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000009.151538
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000006.101025
subTotal3.370000100.00000061.010250
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000114
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000190
Tin solderTin (Sn)7440-31-50.20997999.9900003.801445
subTotal0.210000100.0000003.801826
WirePure metalCopper (Cu)7440-50-80.005662100.0000000.102504
subTotal0.005662100.0000000.102504
total5.523662100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.