Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBZ5V6AT-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ5V6AT-QSOT23TO-236AB7.861230 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346661112151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.134000100.0000001.704568
subTotal0.134000100.0000001.704568
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0023520.0800000.029919
Carbon (C)7440-44-00.0011760.0400000.014959
Chromium (Cr)7440-47-30.0061740.2100000.078537
Cobalt (Co)7440-48-40.0123480.4200000.157075
Iron (Fe)7439-89-61.38180047.00000017.577402
Manganese (Mn)7439-96-50.0246960.8400000.314149
Nickel (Ni)7440-02-01.04105435.41000013.242889
Phosphorus (P)7723-14-00.0005880.0200000.007480
Silicon (Si)7440-21-30.0073500.2500000.093497
Sulphur (S)7704-34-90.0005880.0200000.007480
Pure metal layerCopper (Cu)7440-50-80.38220013.0000004.861835
Silver (Ag)7440-22-40.0796742.7100001.013506
subTotal2.940000100.00000037.398728
Mould CompoundAdditiveNon hazardousProprietary0.1324722.9000001.685131
Triphenylphosphine603-35-00.0022840.0500000.029054
FillerSilica -amorphous-7631-86-93.28896072.00000041.837728
PigmentCarbon black1333-86-40.0022840.0500000.029054
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.68520015.0000008.716193
Phenol Formaldehyde resin (generic)9003-35-40.45680010.0000005.810796
subTotal4.568000100.00000058.107955
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000109
Non hazardousProprietary0.0001050.0555000.001341
Tin solderTin (Sn)7440-31-50.18988699.9400002.415474
subTotal0.190000100.0000002.416925
WireImpurityNon hazardousProprietary0.0000030.0100000.000037
Pure metalCopper (Cu)7440-50-80.02922299.9900000.371724
subTotal0.029225100.0000000.371761
total7.861230100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.