Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NBM5100BBQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NBM5100BBQSOT763-1DHVQFN1621.830005 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356911941154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004566
FillerSilver (Ag)7440-22-40.07476075.0000000.342464
PolymerAcrylic resinProprietary0.0059816.0000000.027397
Resin systemProprietary0.01794218.0000000.082191
subTotal0.099680100.0000000.456619
DieDoped siliconSilicon (Si)7440-21-30.755526100.0000003.460951
subTotal0.755526100.0000003.460951
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.846420
Iron (Fe)7439-89-60.1980572.4000000.907268
Phosphorus (P)7723-14-00.0024760.0300000.011341
Zinc (Zn)7440-66-60.0082520.1000000.037803
subTotal8.252360100.00000037.802831
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.700245
FillerSilica -amorphous-7631-86-90.4341023.4900001.988558
Silica fused60676-86-010.55030284.82000048.329360
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.570927
PigmentCarbon black1333-86-40.0203990.1640000.093445
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.108783
Epoxy resin systemProprietary0.1972741.5860000.903683
Phenolic resinProprietary0.2802392.2530001.283731
subTotal12.438460100.00000056.978732
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009596
Nickel (Ni)7440-02-00.19062791.0000000.873233
Palladium (Pd)7440-05-30.0167588.0000000.076768
subTotal0.209480100.0000000.959597
WirePure metalCopper (Cu)7440-50-80.07192996.5500000.329498
Pure metal layerGold (Au)7440-57-50.0002610.3500000.001194
Palladium (Pd)7440-05-30.0023093.1000000.010579
subTotal0.074500100.0000000.341272
total21.830005100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.