Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NBM7100BBQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NBM7100BBQSOT763-1DHVQFN1621.828846 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356911961154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004566
FillerSilver (Ag)7440-22-40.07476075.0000000.342483
PolymerAcrylic resinProprietary0.0059816.0000000.027399
Resin systemProprietary0.01794218.0000000.082196
subTotal0.099680100.0000000.456643
DieDoped siliconSilicon (Si)7440-21-30.755526100.0000003.461135
subTotal0.755526100.0000003.461135
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.848376
Iron (Fe)7439-89-60.1980572.4000000.907316
Phosphorus (P)7723-14-00.0024760.0300000.011341
Zinc (Zn)7440-66-60.0082520.1000000.037805
subTotal8.252360100.00000037.804839
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.700336
FillerSilica -amorphous-7631-86-90.4341023.4900001.988663
Silica fused60676-86-010.55030284.82000048.331926
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.570957
PigmentCarbon black1333-86-40.0203990.1640000.093450
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.108895
Epoxy resin systemProprietary0.1972741.5860000.903731
Phenolic resinProprietary0.2802392.2530001.283799
subTotal12.438460100.00000056.981757
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009596
Nickel (Ni)7440-02-00.19062791.0000000.873279
Palladium (Pd)7440-05-30.0167588.0000000.076772
subTotal0.209480100.0000000.959648
WirePure metalCopper (Cu)7440-50-80.07081096.5500000.324388
Pure metal layerGold (Au)7440-57-50.0002570.3500000.001176
Palladium (Pd)7440-05-30.0022743.1000000.010415
subTotal0.073340100.0000000.335979
total21.828846100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.