Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NX6008NBKW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NX6008NBKWSOT323SC-705.802178 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346625131153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.185000100.0000003.188458
subTotal0.185000100.0000003.188458
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018290.0900000.031519
Carbon (C)7440-44-00.0008130.0400000.014009
Chromium (Cr)7440-47-30.0042670.2100000.073545
Cobalt (Co)7440-48-40.0085340.4200000.147090
Iron (Fe)7439-89-60.95829147.16000016.516060
Manganese (Mn)7439-96-50.0172720.8500000.297681
Nickel (Ni)7440-02-00.72176635.52000012.439577
Phosphorus (P)7723-14-00.0004060.0200000.007004
Silicon (Si)7440-21-30.0050800.2500000.087553
Sulphur (S)7704-34-90.0004060.0200000.007004
Pure metal layerCopper (Cu)7440-50-80.26497313.0400004.566782
Silver (Ag)7440-22-40.0483622.3800000.833508
subTotal2.032000100.00000035.021332
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.684367
Triphenylphosphine603-35-00.0016850.0500000.029041
FillerSilica -amorphous-7631-86-92.42640072.00000041.818779
PigmentCarbon black1333-86-40.0016850.0500000.029041
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000008.712246
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000005.808164
subTotal3.370000100.00000058.081638
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000109
Bismuth (Bi)7440-69-90.0000020.0010000.000036
Copper (Cu)7440-50-80.0000020.0010000.000036
Lead (Pb)7439-92-10.0000100.0050000.000181
Tin solderTin (Sn)7440-31-50.20997999.9900003.618969
subTotal0.210000100.0000003.619331
WirePure metalCopper (Cu)7440-50-80.005178100.0000000.089238
subTotal0.005178100.0000000.089238
total5.802178100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.