Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NXS0101GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXS0101GMSOT886XSON62.006860 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352897221153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.138570100.0000006.904805
subTotal0.138570100.0000006.904805
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.012457
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.012457
Silica -amorphous-7631-86-90.00250050.0000000.124573
PolymerEpoxy resin systemProprietary0.00150030.0000000.074744
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.024915
subTotal0.005000100.0000000.249145
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000036.356158
Magnesium (Mg)7439-95-40.0011580.1500000.057702
Nickel (Ni)7440-02-00.0227742.9500001.134808
Silicon (Si)7440-21-30.0049410.6400000.246196
Pure metal layerGold (Au)7440-57-50.0001540.0200000.007694
Nickel (Ni)7440-02-00.0126611.6400000.630876
Palladium (Pd)7440-05-30.0006950.0900000.034621
subTotal0.772000100.00000038.468055
Mould CompoundAdditiveNon hazardousProprietary0.0043710.4100000.217783
FillerSilica -amorphous-7631-86-90.0030910.2900000.154042
Silica fused60676-86-00.91835986.15000045.760990
HardenerPhenolic resinProprietary0.0457314.2900002.278754
PigmentCarbon black1333-86-40.0020250.1900000.100924
PolymerEpoxy resin systemProprietary0.0924228.6700004.605314
subTotal1.066000100.00000053.117806
WireGold alloyGold (Au)7440-57-50.02503799.0000001.247576
Palladium (Pd)7440-05-30.0002531.0000000.012602
subTotal0.025290100.0000001.260178
total2.006860100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.