Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS4021PZ-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS4021PZ-QSOT223SC-73104.205250 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346677411151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.10010077.0000000.096060
PolymerResin systemProprietary0.02990023.0000000.028693
subTotal0.130000100.0000000.124754
DieDoped siliconSilicon (Si)7440-21-31.770000100.0000001.698571
subTotal1.770000100.0000001.698571
Lead FrameCopper alloyCopper (Cu)7440-50-850.72514099.15000048.678104
Iron (Fe)7439-89-60.0511600.1000000.049095
Phosphorus (P)7723-14-00.0153480.0300000.014729
Pure metal layerSilver (Ag)7440-22-40.3683520.7200000.353487
subTotal51.160000100.00000049.095415
Mould CompoundAdditiveNon hazardousProprietary1.4149102.9000001.357811
Triphenylphosphine603-35-00.0243950.0500000.023411
FillerSilica -amorphous-7631-86-935.12880072.00000033.711161
PigmentCarbon black1333-86-40.0243950.0500000.023411
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.31850015.0000007.023159
Phenol Formaldehyde resin (generic)9003-35-44.87900010.0000004.682106
subTotal48.790000100.00000046.821057
Post-PlatingImpurityLead (Pb)7439-92-10.0000990.0045000.000095
Non hazardousProprietary0.0012270.0555000.001177
Tin solderTin (Sn)7440-31-52.20867499.9400002.119542
subTotal2.210000100.0000002.120814
WireImpurityNon hazardousProprietary0.0000150.0100000.000014
Pure metalCopper (Cu)7440-50-80.14523599.9900000.139374
subTotal0.145250100.0000000.139388
total104.205250100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.