Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS4160U

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS4160USOT323SC-705.665178 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405811711512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.180000100.0000003.177305
subTotal0.180000100.0000003.177305
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.029390
Carbon (C)7440-44-00.0007400.0400000.013062
Chromium (Cr)7440-47-30.0016650.0900000.029390
Cobalt (Co)7440-48-40.0079550.4300000.140419
Iron (Fe)7439-89-60.82602544.65000014.580742
Manganese (Mn)7439-96-50.0127650.6900000.225324
Nickel (Ni)7440-02-00.63899034.54000011.279257
Phosphorus (P)7723-14-00.0003700.0200000.006531
Silicon (Si)7440-21-30.0048100.2600000.084905
Sulphur (S)7704-34-90.0003700.0200000.006531
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.502475
Silver (Ag)7440-22-40.0429202.3200000.757611
subTotal1.850000100.00000032.655638
Mould CompoundFillerSilica fused60676-86-02.55340075.10000045.071841
PigmentCarbon black1333-86-40.0102000.3000000.180047
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.502759
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.261119
subTotal3.400000100.00000060.015766
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000122
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000203
Tin solderTin (Sn)7440-31-50.22997799.9900004.059484
subTotal0.230000100.0000004.059890
WirePure metalCopper (Cu)7440-50-80.005178100.0000000.091396
subTotal0.005178100.0000000.091396
total5.665178100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.