Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS4230QA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS4230QASOT1215DFN1010D-31.276080 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340671611473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000001.880760
PolymerAcrylic resinProprietary0.00600020.0000000.470190
subTotal0.030000100.0000002.350950
DieDoped siliconSilicon (Si)7440-21-30.160000100.00000012.538399
subTotal0.160000100.00000012.538399
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.099680
Copper (Cu)7440-50-80.50090394.51000039.253260
Tin (Sn)7440-31-50.0012720.2400000.099680
Zinc (Zn)7440-66-60.0011130.2100000.087220
Pure metal layerGold (Au)7440-57-50.0003710.0700000.029073
Nickel (Ni)7440-02-00.0229494.3300001.798398
Palladium (Pd)7440-05-30.0021200.4000000.166134
subTotal0.530000100.00000041.533446
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.0000009.192214
Silica fused60676-86-00.30600060.00000023.979688
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.198984
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.199831
PigmentCarbon black1333-86-40.0025500.5000000.199831
PolymerEpoxy resin systemProprietary0.0357007.0000002.797630
Phenolic resinProprietary0.0306006.0000002.397969
subTotal0.510000100.00000039.966146
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000106
Non hazardousProprietary0.0000170.0555000.001305
Tin solderTin (Sn)7440-31-50.02998299.9400002.349539
subTotal0.030000100.0000002.350950
WireImpurityNon hazardousProprietary0.0000020.0100000.000126
Pure metalGold (Au)7440-57-50.01607899.9900001.259983
subTotal0.016080100.0000001.260109
total1.276080100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.