Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS9410PA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS9410PASOT1061HUSON38.078280 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406392611510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.089341
PolymerAcrylic resinProprietary0.02200020.0000000.272335
subTotal0.110000100.0000001.361676
DieDoped siliconSilicon (Si)7440-21-30.690000100.0000008.541422
subTotal0.690000100.0000008.541422
Lead FrameCopper alloyCopper (Cu)7440-50-82.64136894.20000032.697158
Magnesium (Mg)7439-95-40.0084120.3000000.104131
Nickel (Ni)7440-02-00.0981403.5000001.214863
Silicon (Si)7440-21-30.0243950.8700000.301980
Pure metal layerGold (Au)7440-57-50.0011220.0400000.013884
Nickel (Ni)7440-02-00.0280401.0000000.347104
Palladium (Pd)7440-05-30.0025240.0900000.031239
subTotal2.804000100.00000034.710359
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.216209
FillerSilica -amorphous-7631-86-90.0123540.2900000.152929
Silica fused60676-86-03.66999086.15000045.430339
HardenerPhenolic resinProprietary0.1827544.2900002.262289
PigmentCarbon black1333-86-40.0080940.1900000.100195
PolymerEpoxy resin systemProprietary0.3693428.6700004.572038
subTotal4.260000100.00000052.733998
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000095
Non hazardousProprietary0.0000940.0555000.001168
Tin solderTin (Sn)7440-31-50.16989899.9400002.103146
subTotal0.170000100.0000002.104408
WireImpurityNon hazardousProprietary0.0000040.0100000.000055
Pure metalCopper (Cu)7440-50-80.04427199.9900000.548020
subTotal0.044275100.0000000.548075
total8.078280100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.