Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTB123ET

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTB123ETSOT23TO-236AB7.808740 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405897621514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.210000100.0000002.689294
subTotal0.210000100.0000002.689294
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029379
Carbon (C)7440-44-00.0010200.0400000.013057
Chromium (Cr)7440-47-30.0056080.2200000.071814
Cobalt (Co)7440-48-40.0109610.4300000.140365
Iron (Fe)7439-89-61.22301047.98000015.662068
Manganese (Mn)7439-96-50.0219210.8600000.280729
Nickel (Ni)7440-02-00.92120936.14000011.797148
Phosphorus (P)7723-14-00.0005100.0200000.006529
Silicon (Si)7440-21-30.0066270.2600000.084872
Sulphur (S)7704-34-90.0005100.0200000.006529
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.711499
Silver (Ag)7440-22-40.0655092.5700000.838923
subTotal2.549000100.00000032.642910
Mould CompoundFillerSilica fused60676-86-03.44492071.00000044.116208
PigmentCarbon black1333-86-40.0145560.3000000.186407
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.95584419.70000012.240694
Phenolic resinProprietary0.4366809.0000005.592195
subTotal4.852000100.00000062.135505
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000107
Non hazardousProprietary0.0001030.0555000.001315
Tin solderTin (Sn)7440-31-50.18488999.9400002.367719
subTotal0.185000100.0000002.369140
WirePure metalGold (Au)7440-57-50.012740100.0000000.163151
subTotal0.012740100.0000000.163151
total7.808740100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.