Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD4USB5BBTBS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB5BBTBS-QSOT1176DDFN2510D5.237141 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346650641185126030 s123520 s3
9346650641156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.04500045.0000000.859247
PolymerAcrylic resinProprietary0.01500015.0000000.286416
Phenolic resinProprietary0.01500015.0000000.286416
Resin systemProprietary0.02500025.0000000.477360
subTotal0.100000100.0000001.909439
DieDoped siliconSilicon (Si)7440-21-30.119000100.0000002.272232
subTotal0.119000100.0000002.272232
Lead FrameCopper alloyCopper (Cu)7440-50-81.91682495.84120036.600580
Iron (Fe)7439-89-60.0519392.5969700.991751
Phosphorus (P)7723-14-00.0029970.1498300.057218
Zinc (Zn)7440-66-60.0039950.1997700.076290
ImpurityLead (Pb)7439-92-10.0000560.0028000.001069
Pure metal layerSilver (Ag)7440-22-40.0241891.2094500.461874
subTotal2.000000100.00000038.188783
Mould CompoundFillerSilica -amorphous-7631-86-90.1540007.0000002.940536
Silica fused60676-86-01.82600083.00000034.866352
PigmentCarbon black1333-86-40.0110000.5000000.210038
PolymerEpoxy resin systemProprietary0.1320006.0000002.520459
Phenolic resinProprietary0.0770003.5000001.470268
subTotal2.200000100.00000042.007653
Post-PlatingImpurityNon hazardousProprietary0.0008000.1000000.015276
Tin solderTin (Sn)7440-31-50.79920099.90000015.260235
subTotal0.800000100.00000015.275510
WireImpurityNon hazardousProprietary0.0000000.0000500.000000
Silver (Ag)7440-22-40.0000000.0014500.000005
Pure metalCopper (Cu)7440-50-80.01751596.5485500.334439
Pure metal layerGold (Au)7440-57-50.0000820.4499600.001559
Palladium (Pd)7440-05-30.0005442.9997000.010391
subTotal0.018141100.0000000.346394
total5.237141100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.