Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2005BELD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2005BELDSOD882DDFN1006-20.737888 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066026315812601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.308990
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.042567
Phenolic resinProprietary0.00040613.5300000.055008
subTotal0.003000100.0000000.406566
DieDoped siliconSilicon (Si)7440-21-30.080000100.00000010.841754
subTotal0.080000100.00000010.841754
Lead FrameCopper alloyChromium (Cr)7440-47-30.0008030.2575000.108878
Copper (Cu)7440-50-80.29576094.79500040.082018
Tin (Sn)7440-31-50.0007450.2388000.100971
Zinc (Zn)7440-66-60.0005950.1908000.080676
Pure metal layerGold (Au)7440-57-50.0001720.0550000.023256
Nickel (Ni)7440-02-00.0133914.2920001.814779
Palladium (Pd)7440-05-30.0005330.1709000.072261
subTotal0.312000100.00000042.282840
Mould CompoundFillerSilica -amorphous-7631-86-90.06877023.0000009.319843
Silica fused60676-86-00.17940060.00000024.312633
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089703.0000001.215632
Ion trapping agentBismuth (Bi)7440-69-90.0014950.5000000.202605
PigmentCarbon black1333-86-40.0014950.5000000.202605
PolymerEpoxy resin systemProprietary0.0209307.0000002.836474
Phenolic resinProprietary0.0179406.0000002.431263
subTotal0.299000100.00000040.521055
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000134
Non hazardousProprietary0.0000120.0555000.001655
Tin solderTin (Sn)7440-31-50.02198799.9400002.979693
subTotal0.022000100.0000002.981482
WireImpurityNon hazardousProprietary0.0000020.0100000.000297
Pure metalGold (Au)7440-57-50.02188699.9900002.966007
subTotal0.021888100.0000002.966304
total0.737888100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.