Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2010EPK-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2010EPK-QSOD1608SOD16081.828080 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346665453151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01600080.0000000.875235
PolymerAcrylic resinProprietary0.00400020.0000000.218809
subTotal0.020000100.0000001.094044
DieDoped siliconSilicon (Si)7440-21-30.070000100.0000003.829154
subTotal0.070000100.0000003.829154
Lead FrameCopper alloyCopper (Cu)7440-50-80.99702693.18000054.539517
Magnesium (Mg)7439-95-40.0014980.1400000.081944
Nickel (Ni)7440-02-00.0310302.9000001.697409
Silicon (Si)7440-21-30.0067410.6300000.368748
Pure metal layerGold (Au)7440-57-50.0005350.0500000.029266
Nickel (Ni)7440-02-00.0302812.8300001.656437
Palladium (Pd)7440-05-30.0028890.2700000.158035
subTotal1.070000100.00000058.531355
Mould CompoundFillerSilica -amorphous-7631-86-90.12420023.0000006.794013
Silica fused60676-86-00.32400060.00000017.723513
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0162003.0000000.886176
Ion trapping agentBismuth (Bi)7440-69-90.0027000.5000000.147696
PigmentCarbon black1333-86-40.0027000.5000000.147696
PolymerEpoxy resin systemProprietary0.0378007.0000002.067743
Phenolic resinProprietary0.0324006.0000001.772351
subTotal0.540000100.00000029.539189
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000222
Non hazardousProprietary0.0000500.0555000.002732
Tin solderTin (Sn)7440-31-50.08994699.9400004.920244
subTotal0.090000100.0000004.923198
WireImpurityNon hazardousProprietary0.0000040.0100000.000208
Pure metalGold (Au)7440-57-50.03807699.9900002.082852
subTotal0.038080100.0000002.083060
total1.828080100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.