Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG4005ET

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4005ETSOT23TO-236AB7.751725 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405942821513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.120000100.0000001.548043
subTotal0.120000100.0000001.548043
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029595
Carbon (C)7440-44-00.0010200.0400000.013153
Chromium (Cr)7440-47-30.0056080.2200000.072343
Cobalt (Co)7440-48-40.0109610.4300000.141397
Iron (Fe)7439-89-61.22301047.98000015.777265
Manganese (Mn)7439-96-50.0219210.8600000.282794
Nickel (Ni)7440-02-00.92120936.14000011.883917
Phosphorus (P)7723-14-00.0005100.0200000.006577
Silicon (Si)7440-21-30.0066270.2600000.085496
Sulphur (S)7704-34-90.0005100.0200000.006577
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.738797
Silver (Ag)7440-22-40.0655092.5700000.845093
subTotal2.549000100.00000032.883003
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.825284
Triphenylphosphine603-35-00.0024400.0500000.031470
FillerSilica -amorphous-7631-86-93.51288072.00000045.317397
PigmentCarbon black1333-86-40.0024400.0500000.031470
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.441124
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.294083
subTotal4.879000100.00000062.940829
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000107
Non hazardousProprietary0.0001030.0555000.001325
Tin solderTin (Sn)7440-31-50.18488999.9400002.385134
subTotal0.185000100.0000002.386566
WireImpurityNon hazardousProprietary0.0000020.0100000.000024
Pure metalCopper (Cu)7440-50-80.01872399.9900000.241535
subTotal0.018725100.0000000.241559
total7.751725100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.