Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMGD290UCEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMGD290UCEASOT363SC-885.468158 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067604115312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.914385
subTotal0.050000100.0000000.914385
DieAluminium alloyAluminium (Al)7429-90-50.0012702.5400000.023225
Doped siliconSilicon (Si)7440-21-30.04551591.0300000.832364
Gold alloyGold (Au)7440-57-50.0032156.4300000.058795
subTotal0.050000100.0000000.914385
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.034070
Carbon (C)7440-44-00.0008280.0400000.015142
Chromium (Cr)7440-47-30.0043470.2100000.079497
Cobalt (Co)7440-48-40.0089010.4300000.162779
Iron (Fe)7439-89-60.98118047.40000017.943520
Manganese (Mn)7439-96-50.0175950.8500000.321772
Nickel (Ni)7440-02-00.73919735.71000013.518209
Phosphorus (P)7723-14-00.0004140.0200000.007571
Silicon (Si)7440-21-30.0053820.2600000.098424
Sulphur (S)7704-34-90.0004140.0200000.007571
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.962860
Silver (Ag)7440-22-40.0385021.8600000.704113
subTotal2.070000100.00000037.855526
Mould CompoundAdditiveNon hazardousProprietary0.0846802.9000001.548602
Triphenylphosphine603-35-00.0014600.0500000.026700
FillerSilica -amorphous-7631-86-92.10240072.00000038.448048
PigmentCarbon black1333-86-40.0014600.0500000.026700
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.43800015.0000008.010010
Phenol Formaldehyde resin (generic)9003-35-40.29200010.0000005.340007
subTotal2.920000100.00000053.400066
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000203
Bismuth (Bi)7440-69-90.0000040.0010000.000068
Copper (Cu)7440-50-80.0000040.0010000.000068
Lead (Pb)7439-92-10.0000180.0050000.000338
Tin solderTin (Sn)7440-31-50.36996399.9900006.765770
subTotal0.370000100.0000006.766447
WirePure metalCopper (Cu)7440-50-80.008158100.0000000.149186
subTotal0.008158100.0000000.149186
total5.468158100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.