Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB100XPEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB100XPEASOT1220DFN2020MD-67.017640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340702841157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.797989
PolymerAcrylic resinProprietary0.01400020.0000000.199497
subTotal0.070000100.0000000.997486
DieDoped siliconSilicon (Si)7440-21-30.150000100.0000002.137471
subTotal0.150000100.0000002.137471
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560038.544480
Magnesium (Mg)7439-95-40.0042170.1459000.060084
Nickel (Ni)7440-02-00.0843532.9188001.202018
Silicon (Si)7440-21-30.0182760.6324000.260435
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013714
Nickel (Ni)7440-02-00.0740132.5610001.054669
Palladium (Pd)7440-05-30.0032660.1130000.046536
subTotal2.890000100.00000041.181936
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000012.224908
Silica fused60676-86-02.23800060.00000031.891063
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.594553
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.265759
PigmentCarbon black1333-86-40.0186500.5000000.265759
PolymerEpoxy resin systemProprietary0.2611007.0000003.720624
Phenolic resinProprietary0.2238006.0000003.189106
subTotal3.730000100.00000053.151772
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0000940.0555000.001344
Tin solderTin (Sn)7440-31-50.16989899.9400002.421013
subTotal0.170000100.0000002.422467
WireImpurityNon hazardousProprietary0.0000010.0100000.000011
Pure metalCopper (Cu)7440-50-80.00763999.9900000.108858
subTotal0.007640100.0000000.108869
total7.017640100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.